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发明名称
Method for forming copper wiring of semiconductor device using damascene
摘要
申请公布号
KR100602130(B1)
申请公布日期
2006.07.19
申请号
KR20040117167
申请日期
2004.12.30
申请人
发明人
分类号
H01L21/3205
主分类号
H01L21/3205
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代理人
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地址
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