| 发明名称 |
Method and device for producing a hole |
| 摘要 |
<p>A process for producing a hole (7) in a component (1) comprises using a pulsed energy beam (22), especially a laser. During material removal, different pulse lengths are used at the start to the finish. When the short pulses are used, the beam is moved over the whole surface.</p> |
| 申请公布号 |
EP1681128(A1) |
申请公布日期 |
2006.07.19 |
| 申请号 |
EP20050000729 |
申请日期 |
2005.01.14 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
SETTEGAST, SILKE;BECK, THOMAS;WOLKERS, LUTZ |
| 分类号 |
B23K26/38;F01D5/18 |
主分类号 |
B23K26/38 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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