发明名称 |
Light-emitting diode arrangement comprising a heat-dissipating plate |
摘要 |
The invention relates to a light-emitting arrangement, having:—at least one light-emitting diode chip (1),—a multi-layer board (17) having a base (5) of a thermally well conducting material, in particular of metal, and—an electrical insulating and thermally conducting connection layer (2) between the emission surface of the light-diode chip (1) and the board (17). |
申请公布号 |
EP1680818(A1) |
申请公布日期 |
2006.07.19 |
申请号 |
EP20040818383 |
申请日期 |
2004.11.03 |
申请人 |
TRIDONIC OPTOELECTRONICS GMBH |
发明人 |
TASCH, STEFAN;HOSCHOPF, HANS |
分类号 |
H01L33/64;H05K1/02;H05K1/18 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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