发明名称 Light-emitting diode arrangement comprising a heat-dissipating plate
摘要 The invention relates to a light-emitting arrangement, having:—at least one light-emitting diode chip (1),—a multi-layer board (17) having a base (5) of a thermally well conducting material, in particular of metal, and—an electrical insulating and thermally conducting connection layer (2) between the emission surface of the light-diode chip (1) and the board (17).
申请公布号 EP1680818(A1) 申请公布日期 2006.07.19
申请号 EP20040818383 申请日期 2004.11.03
申请人 TRIDONIC OPTOELECTRONICS GMBH 发明人 TASCH, STEFAN;HOSCHOPF, HANS
分类号 H01L33/64;H05K1/02;H05K1/18 主分类号 H01L33/64
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