发明名称 |
Semiconductor mounting apparatus |
摘要 |
A bond station (1) for mounting semiconductor chips (2) on a substrate (3) comprises wafer (4) and substrate (10) tables and a pick and place device (7) having a movable slot (12) and swivel arm (13) which moves between two positions changing from angled at the wafer table to normal to the substrate table. |
申请公布号 |
EP1480507(B1) |
申请公布日期 |
2006.07.19 |
申请号 |
EP20030101438 |
申请日期 |
2003.05.21 |
申请人 |
UNAXIS INTERNATIONAL TRADING LTD. |
发明人 |
THUERLEMANN, SILVAN |
分类号 |
H05K13/04;H01L21/00;H01L21/52 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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