Apparatus and method for chemical-mechanical polishing (CMP) using a head having a direct pneumatic wafer polishing pressure system

摘要

The invention relates to a substrate carrier for holding a substrate (113) during a processing operation, said substrate carrier comprising: a disk-shaped block (160) of substantially non-porous material having a first surface for mounting said substrate, a second surface, and a third substantially cylindrical surface connecting said first and second surfaces; said first surface being substantially planar except for at least one cavity (250) extending from said substantially planar surface into an interior portion of said substrate carrier; a fluid communication (191',184') channel extending from said cavity to either said second surface or to said third surface to communicate a fluid from a source of fluid to said cavity; said first surface adapted to receive a flexible membrane (161) to cover said cavity and form a chamber (262) capable of holding a pressure when said fluid is communicated from said source of fluid to said cavity; and said membrane (161) expanding when said fluid is communicated under a pressure to said chamber (262) and exerting a force on a substrate (113) mounted to said membrane (161).