| 摘要 |
<p>In order to realize the metallic thin film chip producing method, the metallic thin film chip producing apparatus, and the metallic thin film, each of which allows the excessive unevenness of the metallic thin film to be flattened at low cost, the metallic thin film chip producing apparatus according to the present invention includes, in its vessel (9), pressing means (13) having an insulating substrate (3) and a pressing member (4), a chip placement table (5), and a heater (12) having a coil (7) and a power source (8) for supplying an alternating current to the coil (7). Further, the vessel (9) is provided with a vacuum pump (11) for exhausting air from the vessel (9). A magnetic flux generated by the coil (7) penetrates the metallic thin film (1) of the metallic thin film chip (10) placed on the placement table (5). When the magnetic flux penetrates the metallic thin film (1), an eddy current is induced in the metallic thin film (1) due to electromagnetic induction. The metallic thin film (1) is heated to its fusing point or the vicinity of the fusing point by the eddy current. Further, a load exerted by the insulating pressing member (5) causes a surface profile of the insulating substrate (2) or the insulating substrate (3) to be transcribed onto the metallic thin film (1) so that the metallic thin film (1) is flattened.</p> |
