MULTI CHIP PACKAGE PRODUCT FOR REDUCING STRESS,申请号KR20050003085-传众专利搜索

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发明名称	MULTI CHIP PACKAGE PRODUCT FOR REDUCING STRESS
摘要
申请公布号	KR20060082551(A)	申请公布日期	2006.07.19
申请号	KR20050003085	申请日期	2005.01.13
申请人	SAMSUNG ELECTRONICS CO., LTD.	发明人	KONG, HYEONG SIK
分类号	H01L21/82	主分类号	H01L21/82
代理机构		代理人
主权项
地址

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