发明名称 |
RESIN COMPOSITION, MOLDING MATERIAL, AND MOLDED OBJECT |
摘要 |
<p>A phenolic resin composition in which the phenolic resin can be smoothly cured at a low temperature while inhibiting the generation of free formaldehyde and trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin solution. The epoxy compound functions not only as a hardener for the phenolic resin but as a trapping agent for free phenol. The phenolic resin has been sulfoalkylated and/or sulfialkylated so as to have improved hydrophilicity.</p> |
申请公布号 |
EP1264851(B1) |
申请公布日期 |
2006.07.19 |
申请号 |
EP20010951147 |
申请日期 |
2001.02.05 |
申请人 |
NAGOYA OILCHEMICAL CO., LTD. |
发明人 |
HORIKI, SEINOSUKE;OGAWA, MASANORI;KAJITA, TAKEHIKO;ITOU, KUNINORI |
分类号 |
C08J5/24;C08G8/28;C08G14/12;C08G59/62;C08J3/24;C08L61/06;C08L61/14;C08L63/00 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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