SANDWICHED THERMAL SOLUTION

摘要

ABSTRACT OF THE DISCLOSURE A thermal solution (10) for an electronic device, which is positioned between a heat source (100) and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution (10) facilitates heat dissipation from the heat source (100) while shielding the external surface and/or second component from the heat generated by the heat source (100).