发明名称 |
Method and apparatus for processing a conductive thin film |
摘要 |
A method and apparatus for processing a thin film able to easily form grooves (24) in a conductive thin film (12) on an insulating substrate (10), comprising bringing a first electrode (14) into contact with the conductive thin film, maintaining a conductive state between a tip (22T) of a second electrode (22) with a voltage applied with respect to the first electrode (14) and the surface (125) of the conductive thin film, and using the tip of the second electrode to scan the conductive thin film so as to thereby form grooves passing through the thickness of the conductive thin film and exposing the surface of the insulating substrate at their bottoms in the conductive thin film.
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申请公布号 |
EP1681726(A1) |
申请公布日期 |
2006.07.19 |
申请号 |
EP20060250026 |
申请日期 |
2006.01.05 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
HORIUCHI, MICHIO;SUGANUMA, SHIGEAKI;WATANABE, MISA;TOKUTAKE, YASUE |
分类号 |
H01L31/18;H01L31/0224 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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