发明名称 |
Sealing method for electronic devices formed on a common semiconductor substrate and corresponding circuit structure |
摘要 |
A method for sealing electronic devices formed on a semiconductor substrate includes forming at least one first conductive layer on a first portion of the semiconductor substrate for defining electronic devices, and forming a second conductive layer on a second portion of semiconductor substrate for also defining electronic devices. First regions are formed in the at least one first conductive layer for defining electronic devices, and a first sealing layer is formed on the whole semiconductor substrate to seal the first regions. Second regions are formed in the second conductive layer for defining electronic devices, and a second sealing layer is formed on the whole semiconductor substrate to seal the second regions. |
申请公布号 |
US7078294(B2) |
申请公布日期 |
2006.07.18 |
申请号 |
US20040971774 |
申请日期 |
2004.10.22 |
申请人 |
STMICROELECTONICS S.R.L. |
发明人 |
CAMERLENGHI EMILIO;MAURELLI ALFONSO;PESCHIAROLI DANIELA;ZABBERONI PAOLA |
分类号 |
H01L21/336;H01L21/8234;H01L21/8247;H01L23/31;H01L27/105 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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