| 摘要 |
A contact structure for electrically connecting a spring-loaded connector array and a pad array, the spring-loaded connector array having a plurality of spring-loaded connectors arranged in parallel with each other and the pad array having a plurality of pads arranged so as to come in contact with the plurality of connectors. A tip of a first connector of the plurality of spring-loaded connectors has an initial position that is axially offset from an initial position of a tip of a second connector of the plurality of spring-loaded connectors. A first pad of the plurality of pads that is arranged to come in contact with the first connector is axially offset from a second pad of the plurality of pads.
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