发明名称 Electrical connection materials and electrical connection methods
摘要 The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2 . The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7 , a first binder 8 containing the conductive particles 7 , and a first filler F 1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9 A whose viscosity is lower than that of the first binder 8 and a second filler F 2.
申请公布号 US7078807(B2) 申请公布日期 2006.07.18
申请号 US20050117201 申请日期 2005.04.28
申请人 SONY CORPORATION 发明人 HONDA NORIYUKI;HANAI NOBUHIRO;NAKADA MASAKAZU
分类号 H01L23/48;H01L21/56;H01L21/60;H01R4/04;H05K3/32 主分类号 H01L23/48
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