发明名称 |
Electrical connection materials and electrical connection methods |
摘要 |
The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2 . The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7 , a first binder 8 containing the conductive particles 7 , and a first filler F 1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9 A whose viscosity is lower than that of the first binder 8 and a second filler F 2.
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申请公布号 |
US7078807(B2) |
申请公布日期 |
2006.07.18 |
申请号 |
US20050117201 |
申请日期 |
2005.04.28 |
申请人 |
SONY CORPORATION |
发明人 |
HONDA NORIYUKI;HANAI NOBUHIRO;NAKADA MASAKAZU |
分类号 |
H01L23/48;H01L21/56;H01L21/60;H01R4/04;H05K3/32 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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