METHOD OF REMOVING A LOW-DIELECTRIC LAYER AND METHOD OF RECYCLING A WAFER USING THE SAME,申请号KR20050002991-传众专利搜索

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发明名称	METHOD OF REMOVING A LOW-DIELECTRIC LAYER AND METHOD OF RECYCLING A WAFER USING THE SAME
摘要
申请公布号	KR20060082484(A)	申请公布日期	2006.07.18
申请号	KR20050002991	申请日期	2005.01.12
申请人	SAMSUNG ELECTRONICS CO., LTD.	发明人	HWANG, DONG WON;LEE, YANG KOO;HEO, DONG CHUL;JUN, PIL KWON;LIM, KWANG SHIN;LEE, SANG EON
分类号	H01L21/31;H01L21/02	主分类号	H01L21/31
代理机构		代理人
主权项
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