Thermosetting resin composition and use thereof

摘要

A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R¹ represents hydrogen, a halogen, or a C₁-C₅ hydrocarbon group; R² represents a halogen or a C₁-C₅ hydrocarbon group; x is 0 to 3; and each of m and n is a natural number; and ( 2 ) a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.