Method for fabricating printed circuit board using hybrid build-up process,申请号KR20040077201-传众专利搜索

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发明名称	Method for fabricating printed circuit board using hybrid build-up process
摘要
申请公布号	KR100601473(B1)	申请公布日期	2006.07.18
申请号	KR20040077201	申请日期	2004.09.24
申请人		发明人
分类号	H05K3/46	主分类号	H05K3/46
代理机构		代理人
主权项
地址

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