发明名称 Semiconductor device having a HMP metal gate
摘要 A semiconductor device has a dual-gate electrode structure. The gate electrode has a layered structure including a doped polysilicon film, WSi<SUB>2 </SUB>film, WN film and a W film. The WSi<SUB>2 </SUB>film formed on the polysilicon film in the P-channel area is formed of a number of WSi<SUB>2 </SUB>particles disposed apart from one another, preventing a bilateral diffusion of impurities doped in the polysilicon film.
申请公布号 US7078747(B2) 申请公布日期 2006.07.18
申请号 US20040959213 申请日期 2004.10.06
申请人 ELPIDA MEMORY, INC. 发明人 TAGUWA TETSUYA
分类号 H01L27/148;H01L29/423;H01L21/28;H01L21/324;H01L21/8238;H01L27/092;H01L29/49 主分类号 H01L27/148
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