发明名称 Method of fabricating a robust gate dielectric using a replacement gate flow
摘要 A method is described for selectively treating the properties of a gate dielectric near corners of the gate without altering the gate dielectric in a center region of a gate channel. The method includes providing a structure having a gate opening and depositing a layer of dielectric with a high dielectric constant on a bottom surface and side walls of the gate opening. The corner regions of the high dielectric constant layer formed adjacent to the bottom surface and the side walls of the gate opening are selectively treated without altering the center region of the high dielectric constant layer formed at the bottom surface of the gate opening.
申请公布号 US7078750(B2) 申请公布日期 2006.07.18
申请号 US20040026066 申请日期 2004.12.30
申请人 INTEL CORPORATION 发明人 HARELAND SCOTT A.;DOCZY MARK L.;CHAU ROBERT S.
分类号 H01L29/76;H01L21/265;H01L21/28;H01L21/336;H01L29/51;H01L29/94;H01L31/062;H01L31/113;H01L31/119 主分类号 H01L29/76
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