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发明名称
具有凸块之晶圆结构
摘要
一种具有凸块之晶圆结构,系具有一保护层及复数个暴露出保护层之晶圆焊垫,再者,更包含有依序由钛金属层及铜金属层所组成之线路重分布层形成于晶圆焊垫上,以及一设置于线路重分布层上之球底金属层用以作为凸块与线路重分布层相连接之接合过渡层。另外,更包含一覆盖部分线路重分布层之介电保护层,用以保护线路重分布层。
申请公布号
TW200625480
申请公布日期
2006.07.16
申请号
TW094100564
申请日期
2005.01.07
申请人
日月光半导体制造股份有限公司
发明人
黄敏龙
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
刘正格
主权项
地址
高雄市楠梓加工区经三路26号
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