首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Attaching leads to semiconductors
摘要
申请公布号
US3309760(A)
申请公布日期
1967.03.21
申请号
US19640408634
申请日期
1964.11.03
申请人
THE BENDIX CORPORATION
发明人
REZNICK FRANK J.;NUSSEAR JOHN G.
分类号
H01L21/00;H01L21/288
主分类号
H01L21/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
3D IMAGE PROCESSING APPARATUS, 3D IMAGING APPARATUS, AND PROGRAM
LESSON SUPPORT SYSTEM, SERVER, AND PROGRAM
HUMIDITY CONTROL DEVICE
STAMPING DEVICE
FLEXIBLE PRINTED WIRING BOARD
WATER PURIFYING DEVICE
OBJECT VOLUMETRIC CHANGE MEASUREMENT METHOD
PASTE COMPOSITION FOR ELECTRODE, SOLAR CELL ELEMENT, AND SOLAR CELL
FILE MANAGEMENT SYSTEM AND FILE MANAGEMENT METHOD
GREASE COMPOSITION
IMAGE COMPRESSION METHOD
SUBSTRATE FOR PHOTOELECTRIC CONVERSION ELEMENT WITH MOLYBDENUM ELECTRODE
VACUUM STEAM THAWING APPARATUS
PROBE REPLACEMENT JIG FOR STYLUS TYPE SURFACE SHAPE MEASURING INSTRUMENT
POWER SUPPLY DEVICE
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
ANTI-VIRUS COMPUTER SYSTEM
MULTI-REFLECTOR ANTENNA FEEDING PART
ELECTRONIC DEVICE, METHOD OF CONTROLLING THE SAME, AND PROGRAM
TONER FOR ELECTROSTATIC CHARGE IMAGE DEVELOPMENT, DEVELOPER FOR ELECTROSTATIC CHARGE IMAGE DEVELOPMENT, TONER CARTRIDGE, PROCESS CARTRIDGE, IMAGE FORMING APPARATUS, AND IMAGE FORMING METHOD