VERBINDUNGSSYSTEM ZUM BEFESTIGEN VON HALBLEITERPLATTEN SOWIE VERFAHREN ZUR HERSTELLUNG VON HALBLEITERPLATTEN

摘要

Disclosed is an assembly system for stationing a semiconductor wafer suitable for processing said wafer, said system comprising: (a) a holding block; (b) a semiconductor wafer; and (c) an aqueous adhesive composition interposed between the holding block and the semiconductor wafer. Also disclosed is a process for manufacturing a semiconductor wafer, comprising the steps of: (a) providing a holding block; (b) providing a semiconductor wafer; (c) coating either the holding block or one side of the semiconductor wafer with the foregoing aqueous adhesive composition; (d) contacting either one side of the semiconductor wafer to the coated holding block or the coated side of the semiconductor wafer to the holding block, such that the semiconductor wafer adheres to the coated holding block; (e) polishing the other side of the semiconductor wafer; and (f) removing the semiconductor wafer from the coated holding block.