| 摘要 |
A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED or optical sensor. The molding compound includes a partially-cured epoxy composition, a linear polyol, a dye that absorbs in the region of above 700 nm to about 1200 nm and substantially transmits light from about 400 nm to about 700 nm, and an optional antioxidant material substantially uniformly distributed throughout the epoxy composition. The dye can be dissolved within the epoxy composition by heating a portion of the epoxy composition prior to B-staging of the molding compound. The cured epoxy composition has at least 40% transmittance at 600 nm, less than 10% transmittance at 900 nm, less than 10% transmittance at 1100 nm. |
