发明名称 |
CHEMICAL MECHANICAL PLANARIZATION PAD |
摘要 |
A chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorbtion and electrical characteristics of the CMP pad remain substantially constant during CMP applications. |
申请公布号 |
WO2005049269(A3) |
申请公布日期 |
2006.07.13 |
申请号 |
WO2004US38043 |
申请日期 |
2004.11.15 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC.;BAUM, THOMAS, H. |
发明人 |
BAUM, THOMAS, H. |
分类号 |
H01L21/302;B24B;H01L21/321;H01L21/461 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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