| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board which is reduced in deformation such as warping and waviness. <P>SOLUTION: On one principal plane of a laminate made by stacking a plurality of insulation layers 1 via internal interconnections 6, a rectangular placement 5 is formed to surface-mount an electronic component. In the surrounding area of the placement 5, a plurality of electrode pads 2 are arranged to be electrically connected to the terminals of the electronic component. These electrode pads 2 are electrically connected to the internal interconnections 6 via external interconnections 3 extracted in a direction perpendicular to the outer circumference of the placement and via through conductors 4 embedded in the insulation layers. Between the insulation layers located immediately below the placement 5, a conductor layer 7 whose outer circumference nearly conforms to that of the placement 5 is interposed when seen through the laminate from the top of it. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
