| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a simulation apparatus and a simulation program capable of simulating a processing speed distribution and a processing strength distribution more accurately than the accuracy of prior arts. <P>SOLUTION: The simulation apparatus 1 includes an arithmetic processor 2. The arithmetic processor 2 executes a first process that calculates the density distribution of plasma particles produced between a pair of electrodes 7a, 7b arranged opposite to each other as to a plurality of dimensional axes in an electric field direction or a direction perpendicular to the electrodes 7a, 7b, as the distribution in an m-dimensional space (m is an integer and 1≤m≤2) having one-dimensional axis in the direction of the electric field caused between the electrodes 7a, 7b or the direction perpendicular to the electrodes 7a, 7b; a second process that calculates the density distribution, flow distribution or flux distribution of reactive particles onto a substrate on the basis of a result of the calculation in the first process as the distribution in an n-dimensional space (n is an integer and m<n≤3); and a third process that simulates the processing speed distribution or the processing strength distribution of plasma surface processing applied to the substrate on the basis of a result of the calculation in the second process. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
