| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is used for improving the transmission properties of signals from one of the high-frequency semiconductors mounted on different boards to the other and vice versa. SOLUTION: The semiconductor device is composed of, at least, a printed wiring board 10, interposers 20, a high-frequency signal transmission board connecting board 30, and high-speed transmission semiconductor chips 40. The high-frequency signal transmission board connecting board 30 is mounted on the interposers 20 in a BGA mounting manner through the intermediary of solder balls 51. The high-speed transmission semiconductor chips 40 are mounted on the interposers 20, respectively. Provided that the diameter of a pad provided to the high-frequency signal transmission board connecting board 30 for the BGA solder ball 51 is represented by Cϕ, and that the diameter of another pad provided to the interposer 20 for the BGA solder ball 51 is represented by Iϕ, Cϕand Iϕare so set as to satisfy a formula, Cϕ<Iϕ. COPYRIGHT: (C)2006,JPO&NCIPI |
