| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold resin outer-packaged chip-type solid electrolytic capacitor for restraining an increase in a DF value and an ESR value by thermal stress when mounting a reflow substrate. SOLUTION: When joining a capacitor element and a lead frame at a cathode side, separate positions on the same lead frame are coated with silver paste containing an epoxy resin having strong adhesion force and the silver paste of fluorine-based elastomer rich in elasticity, thus preventing cracks generated in a carbon layer, a cathode conductor layer, or its interface, interlayer separation, or the like and restraining an increase in the DF value and ESR value by a thermal history. COPYRIGHT: (C)2006,JPO&NCIPI
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