| 摘要 |
The present invention is directed, in general, to a chemical mechanical polishing pad comprising a closed-cell thermoplastic foam polishing body. The polishing body comprises an ethylene vinyl acetate block copolymer. The ethylene vinyl acetate block copolymer comprises a vinyl acetate content ranging from about 1 to about 18 wt %. The closed-cell thermoplastic foam polishing body also comprises filler particles comprising an average size ranging from about 1 to about 20 microns. Other aspects of the invention comprise a method for manufacturing the above-described chemical mechanical polishing pad and chemical mechanical polishing apparatus comprising the chemical mechanical polishing pad.
|
