发明名称 MANUFACTURING METHOD OF CERAMIC GREEN SHEET
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic green sheet, with which a precise through hole can be formed without using photosensitive slurry. SOLUTION: In the manufacturing method of the ceramic green sheet for laminated electronic component, a pattern by an elimination material is formed on a substrate, an insulator material is formed and a pattern groove or the through hole is formed by an elimination processing. The manufacturing method of the ceramic green sheet comprises a process for forming the pattern by the elimination material on the substrate, a process for forming a ceramic slurry repelling layer on the pattern by the elimination material, a process for forming the insulator material on a member having the pattern by the elimination material where the ceramic slurry repelling layer is formed and a process for performing the elimination processing on a member where the insulator material is formed. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006186047(A) 申请公布日期 2006.07.13
申请号 JP20040376799 申请日期 2004.12.27
申请人 TDK CORP 发明人 YOSHIDA MASAYUKI;AOKI SHUNJI;SUDO JUNICHI
分类号 H01F41/04;B28B1/30;B28B11/00;H01G4/12;H01G4/30;H01G13/00;H05K3/00 主分类号 H01F41/04
代理机构 代理人
主权项
地址