| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape peeling method and apparatus with a simple structure at a low cost whereby peeled tapes can efficiently be used without waste. SOLUTION: A tape peeling apparatus includes a tape supply reel 16 for supplying a peeling tape 18 to one side of which an adhesive side 20 is provided, a tape winding reel 30 for winding up the peeling tape 18, and an adhering roller 24 for adhering the peeling tape 18 to a protection tape 14 adhered to the surface of a semiconductor wafer 12. In a state that the protection tape 14 is adhered to the peeling tape 18, part of the protection tape 14 adhered to the peeling tape 18 is overlapped to the protection tape 14 of a next semiconductor wafer 12, the peeling tape 18 is adhered to part of the end edge of the protection tape 14 on the semiconductor wafer 12 and the protection tape 14 of the semiconductor wafer 12 is peeled. The tape supply reel 16 is driven in a feed direction slightly longer than the diameter of the protection tape 14 and driven back by a length smaller than the diameter of the protection tape 14. COPYRIGHT: (C)2006,JPO&NCIPI |
