| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable package for a pressure detection system and a pressure detection system that allows improve pressure detection accuracy to increase, while realizing size reduction. SOLUTION: The package for a pressure detection system comprise a first metal layer 8, which is formed on the surface of an insulating substrate 1 and is electrically connected to an electrode of a semiconductor device 3, a second metal layer 10 which is formed on the surface of a diaphragm 2, is electrically connected to a second electrode 7, and is electrically connected to the first metal layer 8 via a joint member 11, and a frame-shaped protrusion part 12 which is formed around a first electrode 7 on the surface of the insulating substrate 1 and defines a region on which the diaphragm 2 is arranged. An empty space 14 is partially formed between the diaphragm 2 and the frame-shaped protrusion part 12. COPYRIGHT: (C)2006,JPO&NCIPI
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