| 摘要 |
A semiconductor device according to the present invention to be mounted on a mounting substrate includes: a connection electrode (22) formed on a surface of the semiconductor device; a solder bump (31) formed on the connection electrode the solder bump electrically and mechanically connecting the connection electrode (22) with a substrate electrode formed on the mounting substrate; and a solder drawing layer (23) provided on the surface of the semiconductor device in a periphery of the solder bump and having a surface portion (42b) composed of a solder-agreeable metal, the solder drawing layer retracting melted solder of the solder bump onto a surface of the solder drawing layer by contact with the melted solder. <IMAGE> |
