发明名称 |
DUAL FLAT NON-LEADED SEMICONDUCTOR PACKAGE |
摘要 |
<p>A DFN semiconductor package includes a Ieadframe having a die bonding pad formed integrally with a drain lead, a gate lead and a source lead, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead and a die gate bonding area coupled to the gate lead, and an encapsulant at least partially covering the die, drain lead, gate lead and source.</p> |
申请公布号 |
WO2006074312(A2) |
申请公布日期 |
2006.07.13 |
申请号 |
WO2006US00356 |
申请日期 |
2006.01.05 |
申请人 |
ALPHA & OMEGA SEMICONDUCTOR LIMITED;LIU, KAI;ZHANG, XIAOTIAN;SUN, MING;LUO, LEESHAWN |
发明人 |
LIU, KAI;ZHANG, XIAOTIAN;SUN, MING;LUO, LEESHAWN |
分类号 |
H01L23/495;H01L23/48 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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