发明名称 LITHOGRAPHY DEVICE AND DEVICE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a system and a method that can compensate for temperature during manufacture of a substrate by reducing an alignment error due to thermal expansion on the basis of a plurality of standards by a lithography device for manufacturing a large-sized device. <P>SOLUTION: A pattern 2 of array marks 20 widely distributed on a substrate 1, and arrays 21 and 22 of dots, are projected on the substrate 1 by a beam patterning and projection system 3 with a patterning radiation beam. An operation system 4 places in the substrate and projection system in relative motion, and a detection system 5 detects the array marks individually. The operation system 4 positions the substrate 1 relatively to the projection system 3, projects the patterning radiation beam on a target portion of the substrate 1, and adjusts pattern data based upon the detection result to perform temperature compensation. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006186370(A) 申请公布日期 2006.07.13
申请号 JP20050372597 申请日期 2005.12.26
申请人 ASML NETHERLANDS BV 发明人 BIJNEN FRANCISCUS GODEFRIDUS CASPER;DE SMIT JOANNES T
分类号 H01L21/027;G03F7/20 主分类号 H01L21/027
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