发明名称 METHOD AND SYSTEM FOR AUTOMATED PROCESS CORRECTION USING MODEL PARAMETERS, AND LITHOGRAPHIC APPARATUS USING SUCH METHOD AND SYSTEM
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for aligning a substrate in a lithographic apparatus. <P>SOLUTION: The substrate includes a plurality of alignment marks. The alignment marks have been defined by a second lithographic apparatus LM2 and are arranged to provide a substrate grid as a coordinate system that includes a first and a second direction, substantially perpendicular to the first direction. The method includes steps of measuring a location and an orientation of the alignment marks to obtain alignment mark data, determining the substrate grid of the substrate from the alignment mark data by using a first substrate grid model with a first set of parameters, determining the substrate grid of the substrate from the alignment mark data by using a second substrate grid model with a second set of parameters including an ortho-scaling parameter in addition to the first set of parameters, and correcting machine-to-machine differences between the lithographic apparatus and the second lithographic apparatus LM2 with automated process control data based on the ortho-scaling parameter. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006186372(A) 申请公布日期 2006.07.13
申请号 JP20050373122 申请日期 2005.12.26
申请人 ASML NETHERLANDS BV 发明人 EDART REMI DANIEL MARIE
分类号 H01L21/027;G03F7/20;H01L21/02 主分类号 H01L21/027
代理机构 代理人
主权项
地址