| 发明名称 |
SOLDER FOR DEVICE PACKAGE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide solder for device package. <P>SOLUTION: The solder for device package includes cores (120), and coating solder (130) coated on surfaces of the cores (120), wherein the cores (120) are formed of a substance having higher heat conductivity than that of the coating solder (130). <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| 申请公布号 |
JP2006186308(A) |
申请公布日期 |
2006.07.13 |
| 申请号 |
JP20050252541 |
申请日期 |
2005.08.31 |
| 申请人 |
SAMSUNG ELECTRO MECH CO LTD |
发明人 |
JANG TAE-HOON;CHOI WON-KYOUNG |
| 分类号 |
H01L23/373;H01L33/44;H01L33/62;H01L33/64 |
主分类号 |
H01L23/373 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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