| 摘要 |
PROBLEM TO BE SOLVED: To provide an MEMS element package in which a stress by a difference in the coefficient of a thermal expansion is reduced and which can aim at a miniaturization and an improvement in a yield simply and to provide a method of manufacturing it. SOLUTION: The MEMS element package includes a substrate 10 for the elements in which the MEMS activity element 11 is formed in a top surface, internal electrode pads 20 connected electrically to both sides of the MEMS activity element of the substrate for the elements at the MEMS activity element, sealing pads 30 located in the outside of the internal electrode pads, a substrate 40 for enclosure which couples with the substrate for the elements through the sealing pads and in which via-holes 41 are formed in parts where the internal electrode pads locate, and external electrode pads 50 formed in the top surface of the substrate for enclosure so that electric connections may be made with the internal electrode pads through the via-holes. The internal electrode pads and sealing pads are formed from Au, and an Au-Au direct bonding of the substrate for the elements and the substrate for the enclosure is performed. COPYRIGHT: (C)2006,JPO&NCIPI
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