| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type electronic component storage mount made of paper, in particular, to provide a chip type electronic component storage mount that can be used in a clean room because it produces little dust. SOLUTION: In the chip type electronic component storage mount for storing chip type electronic components, all faces having cavities and feed holes have hardened resin layers. The hardened resin layers are formed by coating all the faces having the cavities and feed holes with a resin that hardens by radical polymerization selected from a group consisting of heat, ultraviolet irradiation, and electron beam irradiation. COPYRIGHT: (C)2006,JPO&NCIPI
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