| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To selectively remove a barrier layer, and at the same time reduce dishing, and further control the removing speed of a low-k and super-low-k insulating layer. <P>SOLUTION: A polishing composition has a first component, a second component, and a weight average molecular weight of 1,000 to 1,000,000 grams/mole. The first component is 50 to 95 mole percent vinyl alcohol, and the second component contains 0.001 to 2 wt% of a polyvinyl alcohol copolymer more hydrophobic than the vinyl alcohol and 0.05 to 50 wt% silica abrasive particles and has a pH of 8 to 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
