| 摘要 |
PROBLEM TO BE SOLVED: To mount circuit components on both surfaces of a circuit board without imparting a stress to a soldering section even when the circuit board composed of a low-rigidity raw material is applied. SOLUTION: The circuit components 104 to 106 are mounted on one surface 102 of a circuit board body 101, and reinforcing plates 112 with part housings 109 to 111 avoiding the mounted circuit components are stuck on the surface 102 while avoiding the parts by the part housings. The thickness sizes of the reinforcing plates 112 are set so as to made larger than the height sizes of the mounted circuit components 104 to 106 in this case. The circuit board 101 is inverted and a surface 103 on the reverse side is directed in a surface, and the circuit components 401 to 403 are mounted on the surface 103. When the circuits are mounted on the surface 103, a stress is not applied to the soldering section because the circuit board body 101 is not deformed. COPYRIGHT: (C)2006,JPO&NCIPI
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