| 摘要 |
PROBLEM TO BE SOLVED: To provide technology capable of securing tip position accuracy of a contact terminal for inspecting a plurality of semiconductor elements formed on a wafer together with a stable contact resistance value, technology capable of providing a structure for mounting an electronic component for circuit inspection in the vicinity of the contact terminal to improve electric characteristics and reliability, and technology capable of reducing a manufacturing cost of a whole semiconductor device. SOLUTION: When the electric characteristics of the semiconductor chip of a semiconductor wafer 1 are to be inspected, by bringing a plurality of contact terminals 6a provided on the principal plane of a probe sheet 6 of a probe cassette 5 constituting a semiconductor inspection device into contact with a plurality of electrodes 3 of the plurality of semiconductor chips on the principal plane of the wafer 1 provided to face the principal plane of the probe sheet 6, the atmospheric pressure is reduced in a space 13 formed between opposite faces of the principal plane of the probe sheet 6 and the principal plane of the wafer 1. The semiconductor wafer 1 is sucked toward the principal plane of the probe sheet 6 to deform mainly the wafer 1, whereby the plurality of electrodes 3 on the plurality of semiconductor chips of the wafer 1 are pressed against the plurality of contact terminals 6a on the principal plane of the probe sheet 6 opposite to the wafer. COPYRIGHT: (C)2006,JPO&NCIPI
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