ANTI-STATIC SPACER FOR HIGH TEMPERATURE CURING PROCESS OF FLEXIBLE PRINTED CIRCUIT BOARD

摘要

The present invention relates to a spacer for a flexible printed circuit board used in a high temperature process. In particular, in the spacer formed with a permanent anti-static layer for the flexible printed circuit board used in the high temperature process of the present invention, the anti-static layer is formed by coating an anti-static solution comprising a metal oxide, an organic or inorganic binder, and additives for supplying a releasing property, as effective ingredients, and drying it to thereby provide the permanent anti-static property and the releasing property on the surface of the spacer, and the spacer can be used at a high temperature process. The spacer of the present invention is not a spacer for use in general delivery, which can be used in room temperature, and the spacer of the present invention can be used at a high temperature of above 150°C, and does not produce black impurities, and further has the releasing property for preventing the separation of the solder resist of the flexible printed circuit board during the high temperature process.