发明名称 |
Soldering and bonding of electronic components onto a circuit board is accompanied by cooling by airflow |
摘要 |
<p>The mounting of electronic components onto a circuit board using either soldering or a bonding process produces a heating effect that is potentially damaging. Cooling is provided by circulating cool gas that is heated and then passed over a heat conducting heat sink for heat energy transfer and cooling.</p> |
申请公布号 |
DE102004063773(A1) |
申请公布日期 |
2006.07.13 |
申请号 |
DE20041063773 |
申请日期 |
2004.12.30 |
申请人 |
GRAUVOGEL, ULRICH |
发明人 |
GRAUVOGEL, ULRICH;ALWON, HARTMUT |
分类号 |
H05K3/34;H05K3/32;H05K7/20 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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