| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing a circuit board having concave portions on the surface thereof. <P>SOLUTION: Concave portion forming members 23 which have an outer shape correlated with an inner shape of the concave portions 3 to be formed and are formed of a material which disappears when heated are arranged at the positions where the concave portions 3 are to be formed on the surface of an uncured substrate 30 and are caused to sink into the surface of the uncured substrate 30. Then, the concave portion forming members 23 are caused to disappear and the uncured substrate 30 is heated to be cured. Thus, the circuit board 1 is obtained which is formed with the concave portions 3 having the inner shape correlated with the outer shape of the concave portion forming members 23. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
