| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem wherein high-frequency modules must be separately designed when the high-frequency modules are manufactured corresponding to two or more systems of different frequency bands or different communication modes, so that management expenses for dielectric laminated boards are multiplied to cause troubles, such as a cost increase, a delivery delay, risks of unnecessary board stocks, etc. <P>SOLUTION: The high-frequency module is composed of a low-pass filter 13 connected to a first system and a band-pass filter 12 connected to a second system. The band-pass filter 12 is equipped with an inductor 10, a capacitor 11, and a surface acoustic wave filter 12 as surface-mounting parts. When it is unnecessary to cope with the second system, the band-pass filter 12 is set unmounted, and the inductor 10 and the capacitor 11 are replaced with a jumper resistor, whereby the same dielectric laminated boards are capable of coping with the manufacture of the high-frequency modules. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
