发明名称 SEMICONDUCTOR DEVICE, WIRING AND THEIR MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To realize a semiconductor device having an electrode and a wiring of low resistance. SOLUTION: A semiconductor layer has the regions where a p-type dopant, an n-type dopant and (p+n) dopant are respectively introduced, and after eliminating a dopant deposit layer on each of these regions by means of a heat treatment, a silicide film is formed on the semiconductor layer by depositing and heat-treating a metal material. Alternatively, the silicide film is formed by introducing a dopant into the dopant deposit layer, thereafter by depositing a metal material film on the dopant deposit layer, and by carrying out a heat treatment of the metal material film. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006186285(A) 申请公布日期 2006.07.13
申请号 JP20040381419 申请日期 2004.12.28
申请人 TOSHIBA CORP 发明人 SUGURO KYOICHI;DEWA MITSUAKI
分类号 H01L27/092;H01L21/26;H01L21/28;H01L21/3205;H01L21/8238;H01L23/52;H01L29/423;H01L29/49 主分类号 H01L27/092
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