| 摘要 |
Disclosed is a probe device for testing a semiconductor integrated circuit including a micro-pin adapted to make direct contact with the semiconductor integrated circuit and transmit an electric current to the semiconductor integrated circuit; a retaining block enclosing the micro-pin; an interface board having a groove, the micro-pin being inserted into the groove, to transmit an electric current to the semiconductor integrated circuit via the micro-pin; a micro-pin contact portion for improving contact between the micro-pin and the interface board; a mask board mounted on the interface board to retain the micro-pin so that the micro-pin does not detach from the interface board; and a mask board retainer for retaining the mask board on the interface board. The probe device can be constructed in a simple assembly process without soldering. This substantially reduces manufacturing time and cost. The probe device can be easily repaired.
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