| 摘要 |
<P>PROBLEM TO BE SOLVED: To measure an impulsive force received by an electronic component upon mounting the same coping with the mounting position on a substrate on which the mounting position of the electronic component is determined previously employing a mounting device. <P>SOLUTION: In the mounting device for mounting a lead component 4 on the substrate 1, the impulsive force can be measured by detecting a force applied on the lead component 4 upon mounting the lead component 4 by lowering a mounting member 5 and a retaining member 6 through a sheet type pressure sensor 7 provided between the lead component 4 and the substrate 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
