| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board capable of preventing an electrostatic breaking of packaged electronic parts while the electronic parts can be mounted from a metal support layer side. SOLUTION: A method of manufacturing the wiring circuit board comprises the steps of forming a conductive resin layer 3, a base insulating layer 4, a conductor pattern 5, and a cover insulating layer 6 on a metal support substrate 2 one by one; forming a third opening 13 as a bigger aperture than each first opening 11 and each second opening 12 at a facing portion to each magnetic head side connector 8 of the metal support substrate 2; and forming the second opening 12 and the first opening 11 of the same shape respectively corresponding to each magnetic head side connector 8 on the conductive resin layer 3 and the base insulating layer 4. On this suspension substrate 1 with a circuit, if a magnetic head 21 is mounted from the third opening 13 of the metal support layer 2, each terminal 22 of the magnetic head 21 can be electrically connected with each magnetic head side connector 8 in the state where the magnetic head 21 is installed on the reverse face of the conductive resin layer 3. COPYRIGHT: (C)2006,JPO&NCIPI
|
