发明名称 BUMP HEIGHT MEASURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bump height measuring method which can be improved in measuring accuracy. SOLUTION: A luminous energy distribution at the time of irradiating line light 24 is measured to obtain luminous energy profile data in advance, and a luminous energy distribution obtained by a PSD element 51 at the time of irradiating the line light 24 on a bump 3 is estimated as estimated luminous energy distribution data to determine luminous energy to be irradiated on the PSD element 51. Reflected light 25 of the line light 24 irradiated on a work 2 is detected by the PSD element 51, and the centroid position 71 is obtained from the luminous energy distribution of the reflected light 25. If leakage light 81 of the line light 24 is reflected on the surface 82 of the work 2 and then is detected by the PSD element 51, the detecting position of the reflected light 25 from the bump 3 and the detecting position of the reflected light 83 from the surface 82 largely deviate from each other and thereby the centroid position 71 shifts. Assuming the influence given on the centroid position 71 when the reflected light 83 of the leakage light 81 is detected by the PSD element 51, this influence is eliminated using the estimated luminous energy distribution data. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006185988(A) 申请公布日期 2006.07.13
申请号 JP20040375608 申请日期 2004.12.27
申请人 NIDEC TOSOK CORP 发明人 KIKUTA SHIGEYA
分类号 H01L21/60 主分类号 H01L21/60
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